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h
November
28, 1995
ELECTRONIC
GROUP
COMPONE SHARP CORPORATION OPTO-ELECTS DEVICES DIV.
SPECIFICATION
F
\
DEVICE SPECIFICATION
FOR
Business dealing name
PHOTOCOUPLER
MODEL No.
PC817
1. These specification sheets include the contents under the copyright of Sharp Corporation Please keep them with reasonable care as important information. Please don't reproduce or cause anyone reproduce them without Sharp's consent. 2. Please obey the instructions mentioned below for actual use of this device. SHARP takes no responsibility for damage caused by improper use of the devices. (I) This device is designed for general electronic Main uses of this device are as follows; * Computer [ - Measuring - OA equipment equipment
l
("Sharp"].
equipment. equipment
l
- Telecommunication machine
(Terminal) Home appliance, etc.
Tooling
- AV equipment
(2) Please take proper steps in order to maintain reliability and safety, in case this device is used for the uses mentioned below which require high reliability. - Unit concerning - Traffic signal [ control and safety of a vehicle breaker etc. below which equipment equipment require (Trunk) etc. extremely high reliability. (air plane, train, automobile alarm etc.) box
1
* Gas leak detection
* Fire box and burglar
* Other safety equipment,
(3) Please do not use for the uses mentioned - Space equipment [ * Nuclear control * Telecommunication equipment * Medical
1
1
Contact a SHARP representative of sales office in advance devices for any applications other than those applications recommend by SHARP at (1).
when you intend to use S?%4.RP for general electronic equipment
CUSTOMER'S APPROVAL
DATE PRESENTED BY T. Matsumura, Department General Manager of Engineering Dept.,11 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION
DATE
BY
SHARP CORPORATION
1
i
November
28. 1995
1
1. Application This specification applies to the outline Model No. PC8 17series. and characteristics of photocoupler
2. Outline Refer to the attached drawing No. CY7073K02.
3. Ratings
and characteristics sheet, page 3 to 6.
Refer to the attached
4. Reliability Refer to the attached sheet, page 7.
5. Incoming
inspection sheet, page 8.
Refer to the attached
6. Supplement 6.1 Isolation voltage shall be measured in the following method. collector
(11 Short between anode to cathode on the primary to emitter on the secondary side. (21 The dielectric withstand tester with zero-cross
side and between
circuit
shall be used.
(3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured
in insulation
oil.)
SHARP CORPORATION
6.2 Business dealing name (" 0" mark indicates business
dealing name of ordered
product) Test conditions 1,=5mA vc,=5v Ta=25'C
Ordered nroduct
0
Business dealingname PC817Xl PC817XIl PC8 17XI2 PC8 17XI3 PC8 17XI4 PC817XI5 PC8 17Xi6
Rank mark A, B, C, D or no mark A B C D AorB B or C C or D A, B or C B, CorD A, B, C or D 1 .
Ic (mA) 2.5 to 30 4.0 to 8.0 6.5 to 13 10to20 15 to 30 4.0to 13 : 6.5 to 20 10 to 30 4.0 to 20 6.5 to 30 4.oto30
I
I
1
1 PC817XI7 PC8 172U8 I PC8 17XI9 1 PC817XIO
1
I
1
6.3 This Model is approved Approved
by UL.
Model No. : PC8 17
UL file No. : E64380
6.4 This product This product This product
is not designed is assembled incorporates
against
irradiation. input and output. diode.
with electrical non-coherent
light emitting
7. Notes Refer to the attached sheet- 1- 1, 2.
Ta=25"C
l 1 Forward
current
Collector *l *l
current power dissipation
Ic PC Ptot viso Topr Tstg Tsol
50 150 200 5 -30 to +lOO -55 to +125 260
mA mW mW kVrms `C "C "C
Collector
Total power
dissipation
*3 Isolation Operating Storage
voltage temperature
temperature temperature
*4 Soldering
`1 The derating factors of absolute are shown in Fig. 1 to 4. *2 Pulse width_IlOO
maximum
ratings
due to ambient
temperature
,us, Duty ratio : 0.001
(Refer to Fig. 5)
*3 AC for 1 min, 40 to 6O%RH l 4 For 10s
SHARP CORPORATION
3.2 Electra-optical
characteristics
r
Input
Parameter Forward voltage voltage
Syllhl VF vFM 1, Ct
kE0 BvCEO
Condition IFI,=20mA Im=0.5A v,=4v v=o, f=lkHz vc,=20v, Ic=O. 1mA IF.=0 I,=10 /LA, I,=0 IF=0
MIN.
TYP. 1.2
MAX. 1.4 3.0 10
Unit v v PA pF nA V
Peak forward Reverse current Terminal Dark
capacitance
:35
30 -
250 100 -
current
output
Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current
BvECO
6
-
-
V
Ic V CEfsat) RIS0 cf fc
I,=5mA.VcE=5V 1,=2omA Ic=lmA DC500V 40 to 6O%FW v=o, f=lMHz vc,=5v, Ic=2mA R,=lOO R, -3dB vc,=2v Ic=2mA R,=lOO R
2.5
0.1
30 0.2
mA v
Collector-emitter saturation voltage Isolation Transfer characteristics resistance
5XlO'O
1o'l
-
Q
Floating Cut-off
capacitance frequency
0.6 80
1.0 -
pF kHz
Rise time Fall time
tr lf
4 3
18 18
pus pus
Rank mark mark
l2
i
6. 5'0.5
1
Pin Nos. and internal cdnnection diagram
7. 62ro-3 d 2 d T 1. oy 10. oz. 5
1
1. 1
l-J
2. 54$0.25
UNIT:
l/l
mm
l 2) Factory identification
mark shall be or shall not be marked. PC817
SHARP CORPORRTION
(Fig. 1) Forward ambient
current vs. temperature
(Fig. 2) Diode power diss&iok<->, vs. ambient temperature
-..
5 2 .+ i P t;
80 70 60 40 20
3
& 4
-30
0 Ambient
25
55
75
100 Ta ( "C )
125
-30
0 Ambient
25
55
75
100 Ta ( `C )
125
temperature
temperature
(Fig. 3) Collector power dissipation vs. ambient temperature
(Fig. 4) Total power vs. ambient
dissipation temperature
-30
0 Ambient
25
50
75
100 Ta ( `C )
125
r
-30
0 Ambient
25
50
75
100 Ta (`C )
125
temperature
temperature
2 2000 1000 i 500
2 200
z .5
(Fig. 5) Peak forward current vs. duty ratio PulsewidthS Ta=25'C ps
; 100 m" 50 z 2 20 Y 10 2 5 lo-`2 5 lo"2 5 lo-`2 e Duty ratio
5 10"
J
SHARP CORPORATION
4. Reliability The reliability of products shall be satisfied with items listed below. Confidence level : 90% LTPD: 10%/20% Test Items Test Conditions $1 Solderability Soldering Terminal (Tension) heat strength "2 23O"C, 5 s 260C. 10 s Weight : 5N 5 s/each terminal Weight : 2.5N 2 times /each terminal 15000m/s2, 0.5ms 3 times/ tX, +Y, fZ Failure Judgement Criteria Samples (nl Defective(C) n=ll, n=ll, n=ll, v,>ux I,>UXZ Icso >`ux2 Mechanical shock n=ll, direction rc>' ' ' O2
C=O C=O C=O
1.2 n=ll, C=O
Terminal strength (Bending) *3
C=O
Variable vibration
frequency
100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, 2 direction 1 cycle -55 `C to t 125C (30mir-i) (30mi.n) 20 cycles test U
n=ll,
C=O
Temperature cycling
n=22,C=O
Upper
specification limit n=22,C=O
High temp. and high humidity storage High temp. storage Low temp. storage Operation life
+6O'C, 9O%RH,
lOOOh
+125"C,
lOOOh
-55"C, 1 OOOh I,=SOmA, Ptot=200mW Ta=25"C, 1OOOh
L : Lower specification limit
n=22 ,C=O i-i=22 ,C=O n=22.C=0
*l
Test method,
conforms
to JIS C 7021.
`2 Solder shall adhere at the area of 95% or more of immersed portion of lead and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below.
SHARP CORPORATION
5. Incoming
inspection items characteristics
5.1 Inspection (11 Electrical
V,, I,, I,,,
(2) Appearance
VCE:(satj,Ic, R,,,
Visa
5.2 Sampling method and Inspection level
A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items axe shown below.
Defect
Inspection
item
AQL (%)
SHflRP CORPORATION
Precautions
for Photocouplers
1 For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less : The affect to device by ultrasonic cleaning is different by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etc. Please test it in actual using condition and con&m that doesn't occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol Freon TE * TF. DifIon-solvent
(2) Ultrasonic
cleaning
Applicable
solvent
S3-E
Please refrain form using Chloro device as much as possible since the ozonosphere. Before you use to confirm that it does not attack
Fluoro Carbon type solvent to clean it is internationally restricted to protect alternative solvent you are requested package resin.
2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50% / 5years)
SHflRP CORPORRTION
3. Precaution ( 11 If solder refIow :
for Soldering
Photocoupler
It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure.
230t
I
-
200C 180C
25C
(2) Other precautions An infbared Iamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder.

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